Enhanced thermal characterization method of microscale heatsink structures G Takács, PG Szabó, G Bognár Microelectronics Reliability 67, 21-28, 2016 | 17 | 2016 |
Improved thermal characterization method of integrated microscale heat sinks G Takács, PG Szabó, B Plesz, G Bognár Microelectronics Journal 45 (12), 1740-1745, 2014 | 15 | 2014 |
Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink (s) G Takács, PG Szabó, G Bognár Microelectronics Journal 46 (12), 1202-1207, 2015 | 14 | 2015 |
Modelling of the flow-rate dependent partial thermal resistance of integrated microscale cooling structures G Takács, PG Szabó, G Bognár Microsystem Technologies 23 (9), 4001-4010, 2017 | 12 | 2017 |
Fabrication and characterization of microscale heat sinks G Takács, G Bognár, E Bándy, G Rózsás, PG Szabó Microelectronics Reliability 79, 480-487, 2017 | 11 | 2017 |
Thermal modelling of integrated microscale heatsink structures G Bognár, G Takács, L Pohl, PG Szabó Microsystem Technologies 24 (1), 433-444, 2018 | 9 | 2018 |
Compact modeling approach for microchannel cooling and its validation M Németh, G Takács, L Jani, A Poppe Microsystem Technologies 24 (1), 419-431, 2018 | 9 | 2018 |
Thermal modelling of integrated microscale heatsink structures G Bognár, G Takács, L Pohl, PG Szabó 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2016 | 9 | 2016 |
Integrated microscale cooling for concentrator solar cells B Plesz, G Takács, PG Szabó, Z Kohári, M Németh, G Bognár 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2017 | 5 | 2017 |
Improved process for the manufacturing of back contact integrated cooling channels for concentrator solar cells G Rózsás, G Bognár, G Takács, B Plesz 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS …, 2019 | 4 | 2019 |
Generalization of the thermal model of infrared radiation sensors G Bognár, PG Szabó, G Takács Microelectronics Journal 46 (6), 543-550, 2015 | 4 | 2015 |
Process and Measurement of Electroplated Back-Contact Integrated Microchannel Cooling Devices for CPV Cells G Rózsás, G Bognár, G Takács, PG Szabó, B Plesz 2020 26th International Workshop on Thermal Investigations of ICs and …, 0 | 4 | |
Integrating chip-level microfluidics cooling into system level design of digital circuits G Bognár, G Takács, L Pohl, L Jani, A Timár, P Horváth, M Németh, ... 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2017 | 3 | 2017 |
Integrated cooling solution for concentrator photovoltaic cells G Rózsás, G Bognár, G Takács, B Plesz Pollack Periodica 16 (2), 110-116, 2021 | 2 | 2021 |
A novel approach for cooling chiplets in heterogeneously integrated 2.5 D packages applying microchannel heatsink embedded in the interposer G Bognár, G Takács, PG Szabó IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 1 | 2023 |
Thermal modelling of embedded microscale channel structures realized in heterogeneous packaging G Bognár, G Takács, PG Szabó 2022 28th International Workshop on Thermal Investigations of ICs and …, 2022 | | 2022 |
Optimized process for the manufacturing of integrated microchannel cooling devices in the back contact of concentrator solar cells G Rózsás, G Bognár, G Takács, B Plesz 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2022 | | 2022 |
Integrated Thermal Management in System-on-Package Devices G Bognár, G Takács, PG Szabó, G Rózsás, L Pohl, B Plesz Periodica Polytechnica Electrical Engineering and Computer Science 64 (2 …, 2020 | | 2020 |
Integrált mikrocsatornás hűtőeszközök modellezése és karakterizációja G Takács Villamosmérnöki Tudományok Doktori Iskola, 2017 | | 2017 |
Investigation of the pre-heating process during thermosonic wire bonding by FEM simulation T Garami, G Takács, O Krammer, A Szabó 2015 38th International Spring Seminar on Electronics Technology (ISSE), 333-338, 2015 | | 2015 |