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dongkeun oh
dongkeun oh
Η διεύθυνση ηλεκτρονικού ταχυδρομείου έχει επαληθευτεί στον τομέα samsung.com
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Παρατίθεται από
Παρατίθεται από
Έτος
Efficient thermal simulation for 3-D IC with thermal through-silicon vias
D Oh, CCP Chen, YH Hu
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2012
202012
Runtime temperature-based power estimation for optimizing throughput of thermal-constrained multi-core processors
D Oh, NS Kim, CCP Chen, A Davoodi, YH Hu
2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), 593-599, 2010
172010
3DFFT: Thermal analysis of non-homogeneous IC using 3D FFT Green function method
D Oh, CCP Chen, YH Hu
8th International Symposium on Quality Electronic Design (ISQED'07), 567-572, 2007
152007
The compatibility analysis of thread migration and DVFS in multi-core processor
D Oh, CCP Chen, NS Kim, YH Hu
2010 11th International Symposium on Quality Electronic Design (ISQED), 866-871, 2010
52010
METHOD FOR PROVIDING INTERFACE FOR ACQUIRING IMAGE OF SUBJECT, AND ELECTRONIC DEVICE
dongkeun oh, kim gil yoon, kim jeong ki kim, kim min jeong, won jong hun
KR Patent 1,020,180,093,558, 2018
2018
Recent Topics on Modeling of Semiconductor Processes, Devices, and Circuits
RO Topaloglu, P Li
Bentham Science Publishers, 2011
2011
A Mathematical Method for VLSI Thermal Simulation at the System and Circuit Levels
D Oh, CCP Chen, YH Hu
Recent Topics on Modeling of Semiconductor Processes, Devices, and Circuits, 149, 2011
2011
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