| Dynamic surface temperature measurements in ICs J Altet, W Claeys, S Dilhaire, A Rubio Proceedings of the IEEE 94 (8), 1519-1533, 2006 | 92 | 2006 |
| Thermal coupling in integrated circuits: application to thermal testing J Altet, A Rubio, E Schaub, S Dilhaire, W Claeys IEEE Journal of Solid-State Circuits 36 (1), 81-91, 2001 | 82 | 2001 |
| Four different approaches for the measurement of IC surface temperature: application to thermal testing J Altet, S Dilhaire, S Volz, JM Rampnoux, A Rubio, S Grauby, LDP Lopez, ... Microelectronics journal 33 (9), 689-696, 2002 | 63 | 2002 |
| Thermal testing of integrated circuits J Altet, A Rubio Springer Science & Business Media, 2002 | 46 | 2002 |
| Defect-oriented non-intrusive RF test using on-chip temperature sensors L Abdallah, HG Stratigopoulos, S Mir, J Altet 2013 IEEE 31st VLSI Test Symposium (VTS), 1-6, 2013 | 40 | 2013 |
| Electrothermal design procedure to observe RF circuit power and linearity characteristics with a homodyne differential temperature sensor M Onabajo, J Altet, E Aldrete-Vidrio, D Mateo, J Silva-Martinez IEEE Transactions on Circuits and Systems I: Regular Papers 58 (3), 458-469, 2010 | 38 | 2010 |
| CMOS differential and absolute thermal sensors A Syal, V Lee, A Ivanov, J Altet Journal of Electronic Testing 18, 295-304, 2002 | 38 | 2002 |
| Strategies for built-in characterization testing and performance monitoring of analog RF circuits with temperature measurements E Aldrete-Vidrio, D Mateo, J Altet, MA Salhi, S Grauby, S Dilhaire, ... Measurement Science and Technology 21 (7), 075104, 2010 | 33 | 2010 |
| Differential Temperature Sensors Fully Compatible With a 0.35-m CMOS Process E Aldrete-Vidrio, D Mateo, J Altet IEEE Transactions on Components and Packaging Technologies 30 (4), 618-626, 2007 | 29 | 2007 |
| MOSFET temperature sensors for on-chip thermal testing F Reverter, J Altet Sensors and Actuators A: Physical 203, 234-240, 2013 | 21 | 2013 |
| Spatially and frequency-resolved monitoring of intradie capacitive coupling by heterodyne excitation infrared lock-in thermography J León, X Perpiñà, J Altet, M Vellvehi, X Jordà Applied Physics Letters 102 (5), 054103, 2013 | 20 | 2013 |
| A heterodyne method for the thermal observation of the electrical behavior of high-frequency integrated circuits J Altet, E Aldrete-Vidrio, D Mateo, X Perpiñà, X Jordà, M Vellvehi, J Millán, ... Measurement Science and Technology 19 (11), 115704, 2008 | 20 | 2008 |
| Efficiency determination of RF linear power amplifiers by steady-state temperature monitoring using built-in sensors J Altet, D Gomez, X Perpinyà, D Mateo, JL González, M Vellvehi, X Jordà Sensors and Actuators A: Physical 192, 49-57, 2013 | 19 | 2013 |
| On-chip MOSFET temperature sensor for electrical characterization of RF circuits F Reverter, D Gomez, J Altet IEEE Sensors Journal 13 (9), 3343-3344, 2013 | 18 | 2013 |
| Hot-spot detection in integrated circuits by substrate heat-flux sensing X Perpiñà, J Altet, X Jorda, M Vellvehi, J Millan, N Mestres IEEE electron device letters 29 (10), 1142-1144, 2008 | 18 | 2008 |
| DC temperature measurements for power gain monitoring in RF power amplifiers J Altet, D Mateo, D Gómez, X Perpiñà, M Vellvehi, X Jordà 2012 IEEE International Test Conference, 1-8, 2012 | 17 | 2012 |
| Electro-thermal coupling analysis methodology for RF circuits D Gómez, C Dufis, J Altet, D Mateo, JL González Microelectronics Journal 43 (9), 633-641, 2012 | 17 | 2012 |
| Structural RFIC device testing through built-in thermal monitoring J Altet, A Rubio, JL Rosselló, J Segura IEEE Communications Magazine 41 (9), 98-104, 2003 | 17 | 2003 |
| Differential sensing strategy for dynamic thermal testing of ICs J Altet, A Rubio Proceedings. 15th IEEE VLSI Test Symposium (Cat. No. 97TB100125), 434-439, 1997 | 17 | 1997 |
| Survey of robustness enhancement techniques for wireless systems-on-a-chip and study of temperature as observable for process variations M Onabajo, D Gómez, E Aldrete-Vidrio, J Altet, D Mateo, J Silva-Martinez Journal of Electronic Testing 27, 225-240, 2011 | 16 | 2011 |
Diego MateoElectronic Engineering Department, UPCVerified email at upc.edu
