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Jesse Tice
Jesse Tice
Northrop Grumman
Verified email at northropgrummannext.net - Homepage
Title
Cited by
Cited by
Year
Atomically thin femtojoule memristive device
H Zhao, Z Dong, H Tian, D DiMarzi, MG Han, L Zhang, X Yan, F Liu, ...
Advanced Materials 29 (47), 1703232, 2017
1722017
Zero-static power radio-frequency switches based on MoS2 atomristors
M Kim, R Ge, X Wu, X Lan, J Tice, JC Lee, D Akinwande
Nature communications 9 (1), 2524, 2018
1672018
High breakdown electric field in β-Ga2O3/graphene vertical barristor heterostructure
X Yan, IS Esqueda, J Ma, J Tice, H Wang
Applied Physics Letters 112 (3), 2018
1402018
Low-symmetry two-dimensional materials for electronic and photonic applications
H Tian, J Tice, R Fei, V Tran, X Yan, L Yang, H Wang
Nano Today 11 (6), 763-777, 2016
1382016
Emulating bilingual synaptic response using a junction-based artificial synaptic device
H Tian, X Cao, Y Xie, X Yan, A Kostelec, D DiMarzio, C Chang, LD Zhao, ...
ACS nano 11 (7), 7156-7163, 2017
1182017
Spatial-temporal imaging of anisotropic photocarrier dynamics in black phosphorus
B Liao, H Zhao, E Najafi, X Yan, H Tian, J Tice, AJ Minnich, H Wang, ...
Nano Letters 17 (6), 3675-3680, 2017
672017
Dense vertically aligned copper nanowire composites as high performance thermal interface materials
MT Barako, SG Isaacson, F Lian, E Pop, RH Dauskardt, KE Goodson, ...
ACS applied materials & interfaces 9 (48), 42067-42074, 2017
652017
Integrated nanomaterials for extreme thermal management: A perspective for aerospace applications
MT Barako, V Gambin, J Tice
Nanotechnology 29 (15), 154003, 2018
542018
Optimizing the design of composite phase change materials for high thermal power density
MT Barako, S Lingamneni, JS Katz, T Liu, KE Goodson, J Tice
Journal of Applied Physics 124 (14), 2018
532018
Printable materials for the realization of high performance RF components: Challenges and opportunities
ES Rosker, R Sandhu, J Hester, MS Goorsky, J Tice
International Journal of Antennas and Propagation 2018, 1-19, 2018
522018
Microscale liquid transport in polycrystalline inverse opals across grain boundaries
QN Pham, MT Barako, J Tice, Y Won
Scientific reports 7 (1), 10465, 2017
492017
Wafer-scale black arsenic–phosphorus thin-film synthesis validated with density functional perturbation theory predictions
EP Young, J Park, T Bai, C Choi, RH DeBlock, M Lange, S Poust, J Tice, ...
ACS Applied Nano Materials 1 (9), 4737-4745, 2018
442018
Epitaxy-driven synthesis of elemental Ge/Si strain-engineered materials and device structures via designer molecular chemistry
YY Fang, J Tolle, J Tice, AVG Chizmeshya, J Kouvetakis, VR D’Costa, ...
Chemistry of Materials 19 (24), 5910-5925, 2007
442007
Approaching the practical conductivity limits of aerosol jet printed silver
ES Rosker, MT Barako, E Nguyen, D DiMarzio, K Kisslinger, DW Duan, ...
ACS applied materials & interfaces 12 (26), 29684-29691, 2020
432020
Synthesis of butane-like SiGe hydrides: Enabling precursors for CVD of Ge-rich semiconductors
AVG Chizmeshya, CJ Ritter, C Hu, JB Tice, J Tolle, RA Nieman, ...
Journal of the American Chemical Society 128 (21), 6919-6930, 2006
392006
Accurately controlled sequential self-folding structures by polystyrene film
D Deng, Y Yang, Y Chen, X Lan, J Tice
Smart Materials and Structures 26 (8), 085040, 2017
302017
Synthesis of molecular adducts of beryllium, boron, and gallium cyanides: Theoretical and experimental correlations between solid-state and molecular analogues
AVG Chizmeshya, CJ Ritter, TL Groy, JB Tice, J Kouvetakis
Chemistry of Materials 19 (24), 5890-5901, 2007
262007
Atomically thin CBRAM enabled by 2-D materials: Scaling behaviors and performance limits
Z Dong, H Zhao, D DiMarzio, MG Han, L Zhang, J Tice, H Wang, J Guo
IEEE Transactions on Electron Devices 65 (10), 4160-4166, 2018
222018
A novel 3D-printing-enabled “roller coaster” transmission line
J Hester, E Nguyen, J Tice, V Radisic
2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI …, 2017
222017
Direct on-chip 3-D aerosol jet printing with high reliability
X Lan, X Lu, MY Chen, D Scherrer, T Chung, E Nguyen, R Lai, J Tice
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017
202017
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