| Indirect Band Gap Emission by Hot Electron Injection in Metal/MoS2 and Metal/WSe2 Heterojunctions Z Li, G Ezhilarasu, I Chatzakis, R Dhall, CC Chen, SB Cronin Nano letters 15 (6), 3977-3982, 2015 | 67 | 2015 |
| Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (< 6 µm) and Reliable Flexible Cu-Based … A Hanna, A Alam, T Fukushima, S Moran, W Whitehead, SC Jangam, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1505-1511, 2018 | 26 | 2018 |
| “FlexTrate^ TM”—Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP T Fukushima, A Alam, Z Wan, SC Jangam, S Pal, G Ezhilarasu, A Bajwa, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 649-654, 2017 | 26 | 2017 |
| A flexible, heterogeneously integrated wireless powered system for bio-implantable applications using fan-out wafer-level packaging G Ezhilarasu, A Hanna, R Irwin, A Alam, SS Iyer 2018 IEEE International Electron Devices Meeting (IEDM), 29.7. 1-29.7. 4, 2018 | 17 | 2018 |
| Heterogeneous integration of a fan-out wafer-level packaging based foldable display on elastomeric substrate A Alam, A Hanna, R Irwin, G Ezhilarasu, H Boo, Y Hu, CW Wong, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 277-282, 2019 | 16 | 2019 |
| A high spatial resolution surface electromyography (sEMG) system using fan-out wafer-level packaging on FlexTrate™ A Alam, M Molter, B Gaonkar, A Hanna, R Irwin, S Benedict, G Ezhilarasu, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 985-990, 2020 | 13 | 2020 |
| High Yield Precision Transfer and Assembly of GaN µLEDs Using Laser Assisted Micro Transfer Printing G Ezhilarasu, A Hanna, A Paranjpe, SS Iyer 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1470-1474, 2019 | 8 | 2019 |
| A heterogeneously integrated, high resolution and flexible inorganic μLED display using fan-out wafer-level packaging G Ezhilarasu, A Paranjpe, J Lee, F Wei, SS Iyer 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 677-684, 2020 | 7 | 2020 |
| A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils G Ouyang, G Ezhilarasu, H Sun, H Ren, YT Yang, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2266-2271, 2021 | 4 | 2021 |
| A Heterogeneously Integrated and Flexible Inorganic Micro-display on FlexTrate™ using Fan-Out Wafer-Level Packaging H Sun, G Ezhilarasu, G Ouyang, R Irwin, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1390-1394, 2022 | 2 | 2022 |
| Heterogenous integration of MEMS gas sensor using FOWLP: Personal environment monitors S Benedict, A Nagarajan, K Thejas, A Alam, MS Illango, G Ezhilarasu, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 824-828, 2020 | 2 | 2020 |
| FlexTrate A Biocompatible Flexible Electronics Platform for High Performance Applications using Fan-Out Wafer-level Packaging A Hanna, A Alam, G Ezhilarasu, T Fukushima, SS Iyer, ... University of California Los Angeles Los Angeles United States, 2019 | 2 | 2019 |
| Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane G Ouyang, A Hanna, S Benedict, G Ezhilarasu, A Alam, RW Irwin, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 1 | 2022 |
| Integrated Micro-Capacitors & Micro-Inductors for Next Generation Electronics G Ezhilarasu, SS Iyer IEEE Nanotechnology Magazine, 2024 | | 2024 |
| Flexible inorganic microled display device and method of manufacturing thereof SS Iyer, G Ezhilarasu US Patent App. 18/007,697, 2023 | | 2023 |
| Flexible, Heterogeneously Integrated microLED Displays in Elastomeric Substrates Using Fan-Out Wafer-Level Packaging G Ezhilarasu University of California, Los Angeles, 2021 | | 2021 |
| Adhesive bonding for flexible microLED display assembly G Ezhilarasu, S Iyer, A Paranjpe, J Lee, F Wei Chip Scale Review Magazine, 54-56, 2021 | | 2021 |
| Fine Pitch (40μm) Integration Platform for Flexible Hybrid Electronics using Fan-Out Wafer-level Packaging A Hanna, A Alam, G Ezhilarasu, SS Iyer International Symposium on Microelectronics 2018 (1), 000064-000068, 2018 | | 2018 |
| Indirect Band Gap Emission by Hot Electron Injection in Metal/MoS and Metal/WSe Heterojunctions Z Li, G Ezhilarasu, I Chatzakis, R Dhall, CC Chen, S Cronin Bulletin of the American Physical Society 61, 2016 | | 2016 |
| Nanopackaging for FutureG Solutions GSG AL-DUHNI, MM HASAN, N PALA, MRAJ PULUGURTHA, ... | | |
SUBRAMANIAN S. IYERUniversity of California at Los Angeles,Verified email at g.ucla.edu
