phil mawby
phil mawby
professor of power electronics, School of Engineering, university of warwick, UK
Verified email at warwick.ac.uk
Title
Cited by
Cited by
Year
An industry-based survey of reliability in power electronic converters
S Yang, A Bryant, P Mawby, D Xiang, L Ran, P Tavner
IEEE transactions on Industry Applications 47 (3), 1441-1451, 2011
11592011
Condition monitoring for device reliability in power electronic converters: A review
S Yang, D Xiang, A Bryant, P Mawby, L Ran, P Tavner
IEEE Transactions on Power Electronics 25 (11), 2734-2752, 2010
7762010
A lifetime estimation technique for voltage source inverters
H Huang, PA Mawby
IEEE Transactions on Power Electronics 28 (8), 4113-4119, 2012
2462012
Theory of a novel voltage-sustaining layer for power devices
XB Chen, PA Mawby, K Board, CAT Salama
Microelectronics journal 29 (12), 1005-1011, 1998
1791998
Investigation into IGBT dV/dt during turn-off and its temperature dependence
A Bryant, S Yang, P Mawby, D Xiang, L Ran, P Tavner, PR Palmer
IEEE Transactions on Power Electronics 26 (10), 3019-3031, 2011
1482011
Exploration of power device reliability using compact device models and fast electrothermal simulation
AT Bryant, PA Mawby, PR Palmer, E Santi, JL Hudgins
IEEE transactions on industry applications 44 (3), 894-903, 2008
1402008
Monitoring solder fatigue in a power module using case-above-ambient temperature rise
D Xiang, L Ran, P Tavner, A Bryant, S Yang, P Mawby
IEEE Transactions on Industry Applications 47 (6), 2578-2591, 2011
1332011
Condition monitoring power module solder fatigue using inverter harmonic identification
D Xiang, L Ran, P Tavner, S Yang, A Bryant, P Mawby
IEEE Transactions on Power Electronics 27 (1), 235-247, 2011
1112011
Field-effect mobility temperature modeling of metal-oxide-semiconductor transistors
A Pérez-Tomás, P Brosselard, P Godignon, J Millán, N Mestres, ...
Journal of applied physics 100 (11), 114508, 2006
1042006
Temperature and switching rate dependence of crosstalk in Si-IGBT and SiC power modules
S Jahdi, O Alatise, JAO Gonzalez, R Bonyadi, L Ran, P Mawby
IEEE Transactions on Industrial Electronics 63 (2), 849-863, 2015
792015
Physically based compact device models for circuit modelling applications
PA Mawby, PM Igic, MS Towers
Microelectronics Journal 32 (5-6), 433-447, 2001
742001
A fast loss and temperature simulation method for power converters, part II: 3-D thermal model of power module
I Swan, A Bryant, PA Mawby, T Ueta, T Nishijima, K Hamada
IEEE Transactions on Power Electronics 27 (1), 258-268, 2011
702011
A fast power loss calculation method for long real time thermal simulation of IGBT modules for a three-phase inverter system
Z Zhou, MS Khanniche, P Igic, ST Kong, M Towers, PA Mawby
2005 European Conference on Power Electronics and Applications, 9 pp.-P. 10, 2005
662005
Capacitor selection for modular multilevel converter
Y Tang, L Ran, O Alatise, P Mawby
IEEE Transactions on Industry Applications 52 (4), 3279-3293, 2016
632016
Modelling the inhomogeneous SiC Schottky interface
PM Gammon, A Pérez-Tomás, VA Shah, O Vavasour, E Donchev, ...
Journal of Applied Physics 114 (22), 223704, 2013
622013
LowStress Cycle Effect in IGBT Power Module Die-Attach Lifetime Modeling
W Lai, M Chen, L Ran, O Alatise, S Xu, P Mawby
IEEE Transactions on Power Electronics 31 (9), 6575-6585, 2015
582015
The impact of parasitic inductance on the performance of silicon–carbide Schottky barrier diodes
O Alatise, NA Parker-Allotey, D Hamilton, P Mawby
IEEE transactions on power electronics 27 (8), 3826-3833, 2012
582012
A fast loss and temperature simulation method for power converters, Part I: Electrothermal modeling and validation
A Bryant, NA Parker-Allotey, D Hamilton, I Swan, PA Mawby, T Ueta, ...
IEEE transactions on power electronics 27 (1), 248-257, 2011
572011
An analysis of the switching performance and robustness of power MOSFETs body diodes: A technology evaluation
S Jahdi, O Alatise, R Bonyadi, P Alexakis, CA Fisher, JAO Gonzalez, ...
IEEE Transactions on Power Electronics 30 (5), 2383-2394, 2014
552014
Experimental investigation on the effects of narrow junction temperature cycles on die-attach solder layer in an IGBT module
W Lai, M Chen, L Ran, S Xu, N Jiang, X Wang, O Alatise, P Mawby
IEEE Transactions on Power Electronics 32 (2), 1431-1441, 2016
542016
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