Παρακολούθηση
Vikram Maharshi
Vikram Maharshi
Indian Institute of Technology, Delhi
Η διεύθυνση ηλεκτρονικού ταχυδρομείου έχει επαληθευτεί στον τομέα ee.iitd.ac.in
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Παρατίθεται από
Παρατίθεται από
Έτος
A novel sensor for fruit ripeness estimation using lithography free approach
V Maharshi, S Sharma, R Prajesh, S Das, A Agarwal, B Mitra
IEEE Sensors Journal 22 (22), 22192-22199, 2022
112022
Thermally actuated MEMS micromirror: design aspects
V Mere, V Maharshi, A Agarwal
Asian J. Phys 23 (4), 00-001, 2014
42014
A resistance change detection circuitry for thread based resistive sensors
N Samaddar, MI Wani, V Maharshi, S Sonkusale, S Malik
2023 IEEE Applied Sensing Conference (APSCON), 1-3, 2023
32023
Wafer level hermetic bonding and packaging using recrystallized parylene
V Maharshi, I Ahmad, A Agarwal, B Mitra
Journal of Micromechanics and Microengineering 33 (1), 014004, 2022
32022
Multi-layered [Au/Si3N4/SiO2] thermal actuator realization using metal passivated TMAH micro-machining
V Maharshi, V Mere, A Agarwal
Engineering Research Express 1 (1), 015006, 2019
32019
Design and fabrication of electro-thermal 1-D micro-mirror
V Maharshi, V Mere, A Agarwal
2018 IEEE Electron Devices Kolkata Conference (EDKCON), 419-422, 2018
32018
Contact study of MEMS high g impact sensor
V Maharshi, A Agarwal, B Mitra
2020 5th IEEE International Conference on Emerging Electronics (ICEE), 1-4, 2020
22020
A Thin Film Porous Alumina Vacuum Package Utilizing a Pore Sealing Getter
V Maharshi, A Agarwal, B Mitra
Journal of Microelectromechanical Systems, 2023
12023
Modeling of electrothermal microactuator
V Maharshi, V Mere, A Agarwal
Computational Mathematics, Nanoelectronics, and Astrophysics: CMNA 2018 …, 2021
12021
Multi-layered thermal actuator realization using metal passivated TMAH micro-machining
V Maharshi, V Mere, A Agarwal
2018 IEEE Electron Devices Kolkata Conference (EDKCON), 392-395, 2018
12018
A Low-Temperature Hybrid Bonding using Copper and Parylene for Heterogeneous Integration
V Maharshi, AS Khan, A Agarwal, B Mitra
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024
2024
An Air Dielectric Semi-Coaxial Line for mm-wave Applications
AS Khan, V Maharshi, PK Shrivastava, B Mitra
2023 Asia-Pacific Microwave Conference (APMC), 802-804, 2023
2023
Touch sensor detects ripeness of tomatoes
V Maharshi, A Agarwal, B Mitra
Nature, Research highlights, 2023
2023
Reusable porous alumina-based adsorber for removal of copper ions from top sediments layers of water bodies and effluents discards
V Maharshi, P Vinayak, M Singh, A Agarwal, B Mitra
2023 IEEE Applied Sensing Conference (APSCON), 1-3, 2023
2023
MEMS Thin-Film Vacuum Package Utilizing Glow Discharge Getter
V Maharshi, M Kumar, A Agarwal, B Mitra
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems …, 2023
2023
A Novel Technique To Realize a Flexible Tactile Sensor
V Maharshi, A Agarwal, B Mitra
2022 IEEE International Conference on Emerging Electronics (ICEE), 1-4, 2022
2022
Low Cost Chemically Etched Anodized Alumina Dielectric for RF and mmW applications
AS Khan, V Maharshi, A Agarwal, B Mitra
International conference on electrical engineering (ICEE), 2022, 2022
2022
Reliability Analysis of Thermally Actuated MEMS Micromirror
V Maharshi, A Agarwal
Micro and Nanoelectronics Devices, Circuits and Systems, 427-436, 2022
2022
Design and Fabrication of MEMS High G Impact Sensor
V Maharshi, V Tiwari, A Agarwal, B Mitra
International Conference on Emerging Electronics (ICEE) 2018, 454-458, 2018
2018
Thermally Actuated MEMS Micro Mirror: Design Aspects
V Mere, V Maharshi, Aditi, A Agarwal
International Conference on Optics and Optoelectronics -ICOL 2014 Dehradun, 217, 2014
2014
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