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- Emanuel TutucProfessor, The University of Texas at AustinVerified email at mer.utexas.edu
- Kyounghwan KimAppleVerified email at utexas.edu
- Amritesh RaiFront End Process Integration Engineer @ Intel ▪ UT Austin ▪ Ohio StateVerified email at utexas.edu
- Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
- Sangwoo KangIntel CorporationVerified email at intel.com
- Babak FallahazadIntel CorporationVerified email at intel.com
- Stefano LarentisFA Engineer @ NXP SemiconductorsVerified email at utexas.edu
- Anupam RoyThe University of Texas at AustinVerified email at austin.utexas.edu
- Christopher M CorbetUniversity of Texas at AustinVerified email at fenwick.com
- T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
- Leonard F. RegisterProfessor of Electrical and Computer EngineeringVerified email at austin.utexas.edu
- Samaresh GuchhaitHoward University, Washington, DCVerified email at Howard.edu
- Sushant SondeUT Austin, CNR-IMM, IMECVerified email at austin.utexas.edu
- Luigi ColomboUniversity of Texas at DallasVerified email at utdallas.edu
- Tanmoy PramanikIIT Roorkee, Intel Corporation, The University of Texas at AustinVerified email at ece.iitr.ac.in
- Amithraj ValsarajCore Compact Modeling, Intel CorporationVerified email at utexas.edu
- Rudresh (Rudy) GhoshUniversity of Texas at AustinVerified email at rudyghosh.com
- Atresh SanneIntel, University of Texas at AustinVerified email at utexas.edu
- Kayoung LeeKAISTVerified email at kaist.ac.kr
- Tanuj TrivediIntel CorpVerified email at utexas.edu