| Reliability testing of electronic packages in harsh environments M Mirgkizoudi, C Liu, S Riches 2010 12th Electronics Packaging Technology Conference, 224-230, 2010 | 19 | 2010 |
| Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions M Mirgkizoudi, C Liu, PP Conway, S Riches Microelectronics Reliability 55 (6), 952-960, 2015 | 7 | 2015 |
| Effects of combined thermal and vibration loadings on the wire bond integrity KA Kamaludin, M Mirgkizoudi, C Liu, S Riches 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 7 | 2011 |
| Combined temperature and vibration testing for wire bond interconnections in harsh environment electronics M Mirgkizoudi, C Liu, P Conway, S Riches Additional Papers and Presentations 2012 (HITEC), 000335-000344, 2012 | 5 | 2012 |
| Hybrid additive manufacturing of precision engineered ceramic components J Hinton, D Basu, M Mirgkizoudi, D Flynn, R Harris, R Kay Rapid Prototyping Journal 25 (6), 1061-1068, 2019 | 4 | 2019 |
| Digitally-driven hybrid manufacture of ceramic thick-film substrates J Hinton, M Mirgkizoudi, A Campos-Zatarain, D Flynn, RA Harris, RW Kay 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-5, 2018 | 4 | 2018 |
| Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments M Mirgkizoudi, C Liu, P Conway, S Riches Additional Papers and Presentations 2013 (HITEN), 000220-000228, 2013 | 4 | 2013 |
| Combined temperature and vibration testing for wire bond interconnections in harsh environment electronics M Mirgkizoudi, C Liu, PP Conway, S Riches Journal of microelectronics and electronic packaging 10 (2), 80-88, 2013 | 3 | 2013 |
| Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration Loads R Man, C Liu, M Mirgkizoudi, S Riches Additional Papers and Presentations 2014 (HITEC), 000263-000270, 2014 | 2 | 2014 |
| Mechanical and interfacial characteristics of Zn-Al solder joints under elevated temperature and vibration conditions L Liu, M Mirgkizoudi, P Zhang, L Zhou, C Liu Proceedings of the 5th Electronics System-integration Technology Conference …, 2014 | 1 | 2014 |
| Characterization of Cu-Sn SLID interconnects for harsh environment applications A Campos-Zatarain, D Flynn, KE Aasmundtveit, N Hoivik, K Wang, H Liu, ... 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2014 | 1 | 2014 |
| Extreme environment interconnects and packaging for power electronics A Campos‐Zatarain, J Hinton, M Mirgkizoudi, J Li, R Harris, RW Kay, ... The Journal of Engineering 2019 (17), 4226-4230, 2019 | | 2019 |
| Extreme Environment Interconnects and Packaging for Power Electronics D Flynn, AC Zatarain, RW Kay, RA Harris, M Mirgkizoudi 9th International Conference on Power Electronics, Machines and Drives 2018, 2018 | | 2018 |
| 2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC 2018-PROCEEDINGS J Meyer, PJ Upasani, S Bickel, I Panchenko, WM Jurgen, O Krammer, ... | | 2018 |
| Evaluation of High Temperature Joining Technologies for Semiconductor Die Attach S Qi, C Powley, M Mirgkizoudi, A Pliscott, P Collier Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2017 (HiTEN …, 2017 | | 2017 |
| Performance of wire-bonded interconnects under combined thermal and vibration loads M Mirgkizoudi Loughborough University, 2015 | | 2015 |
| Effects of Combined Harsh Conditions on Wire Bond Reliability M Mirgkizoudi, C Liu, P Conway, S Riches AIP Conference Proceedings, 2012 | | 2012 |
Professor Robert KayUniversity of LeedsΗ διεύθυνση ηλεκτρονικού ταχυδρομείου έχει επαληθευτεί στον τομέα leeds.ac.uk
