| Experimental evaluations of printed circuit board and on-chip inductors backed by AMC surfaces D Kostka, R Abhari IEEE Antennas and Wireless Propagation Letters 8, 720-723, 2009 | 12 | 2009 |
| 3D IC-package-board co-analysis using 3D EM simulation for mobile applications D Kostka, T Song, SK Lim 2013 IEEE 63rd Electronic Components and Technology Conference, 2113-2120, 2013 | 6 | 2013 |
| Electrical performance of high speed signaling in coupled microstrip lines D Kostka, AC Scogna, F Paglia, B Mutnury 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging …, 2011 | 4 | 2011 |
| Inductance improvement by using artificial magnetic conductor surfaces D Kostka, R Abhari 2008 IEEE Antennas and Propagation Society International Symposium, 1-4, 2008 | 4 | 2008 |
| Modeling of RF desense for mobile electronics D Kostka, A Barchanski, I Hänninen, M Plonka, C Rieckmann 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017 | 3 | 2017 |
| High speed single-ended bus: Full-wave modeling methodology and correlation M Lai, D Kostka, J Casanova, M Seshadhri 2013 IEEE International Symposium on Electromagnetic Compatibility, 587-592, 2013 | 3 | 2013 |
| High performance computing techniques for efficient 3D full-wave simulation of EMC problems I Hänninen, F Wolfheimer, A Barchanski, D Kostka 2014 International Symposium on Electromagnetic Compatibility, Tokyo, 828-831, 2014 | 2 | 2014 |
| Analysis of Power Distribution Networks using Multiconductor Transmission Line Theory K Payandehjoo, D Kostka, R Abhari 2007 IEEE Electrical Performance of Electronic Packaging, 271-274, 2007 | 2 | 2007 |
| Accurate and efficient simulation of bioelectromagnetic models A Pandey, N Parthasarathy, D Kostka, A Prokop, T Wittig 2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI …, 2017 | 1 | 2017 |
| Silicon interposer interconnect structures analysis—3D full wave simulations and measurements AC Scogna, D Kostka, M Troescher, A Steinhardt, R Trieb, A Heinig, ... 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016 | | 2016 |
| Electrical performance of via transitions in the presence of overlapping anti-pads D Kostka, AC Scogna, J Zhang, K Qiu, R Brooks 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging …, 2012 | | 2012 |
| Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board Designs D Kostka, AC Scogna Journal of microelectronics and electronic packaging 9 (2), 52-64, 2012 | | 2012 |
| 3D Electromagnetic Modeling of Through Silicon Vias and Interposers in Electronic Packaging D Kostka, AC Scogna International Symposium on Microelectronics 2012 (1), 001057-001067, 2012 | | 2012 |
| Studying the Impact of Return Current Path on the EM Simulation of High-speed Package Designs D Kostka, AC Scogna International Symposium on Microelectronics 2011 (1), 000061-000068, 2011 | | 2011 |
| Enhancement of printed inductors using artificial magnetic conductor (AMC) surfaces for millimeter-wave applications D Kostka McGill University, 2009 | | 2009 |
