Παρακολούθηση
Ai Ting Tan
Ai Ting Tan
PhD student
Η διεύθυνση ηλεκτρονικού ταχυδρομείου έχει επαληθευτεί στον τομέα siswa.um.edu.my
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Παρατίθεται από
Παρατίθεται από
Έτος
Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
AT Tan, AW Tan, F Yusof
Science and technology of advanced materials 16 (3), 033505, 2015
802015
Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering
AT Tan, AW Tan, F Yusof
Ultrasonics sonochemistry 34, 616-625, 2017
482017
Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power
AT Tan, AW Tan, F Yusof
Journal of Alloys and Compounds 705, 188-197, 2017
432017
Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints
AT Tan, AW Tan, F Yusof
Journal of Materials Processing Technology 238, 8-14, 2016
162016
Ultrasonic assisted reflow soldering of lead free solder joint/Tan Ai Ting
AT Tan
University of Malaya, 2017
2017
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