Igor Loi
Igor Loi
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Near-threshold RISC-V core with DSP extensions for scalable IoT endpoint devices
M Gautschi, PD Schiavone, A Traber, I Loi, A Pullini, D Rossi, E Flamand, ...
IEEE transactions on very large scale integration (VLSI) systems 25 (10 …, 2017
Design issues and considerations for low-cost 3-D TSV IC technology
G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ...
IEEE Journal of Solid-State Circuits 46 (1), 293-307, 2010
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
I Loi, S Mitra, TH Lee, S Fujita, L Benini
2008 IEEE/ACM International Conference on Computer-Aided Design, 598-602, 2008
GAP-8: A RISC-V SoC for AI at the Edge of the IoT
E Flamand, D Rossi, F Conti, I Loi, A Pullini, F Rotenberg, L Benini
2018 IEEE 29th International Conference on Application-specific Systems …, 2018
An IoT endpoint system-on-chip for secure and energy-efficient near-sensor analytics
F Conti, R Schilling, PD Schiavone, A Pullini, D Rossi, FK Gürkaynak, ...
IEEE Transactions on Circuits and Systems I: Regular Papers 64 (9), 2481-2494, 2017
A fully-synthesizable single-cycle interconnection network for shared-L1 processor clusters
A Rahimi, I Loi, MR Kakoee, L Benini
2011 Design, Automation & Test in Europe, 1-6, 2011
Mr. Wolf: An energy-precision scalable parallel ultra low power SoC for IoT edge processing
A Pullini, D Rossi, I Loi, G Tagliavini, L Benini
IEEE Journal of Solid-State Circuits 54 (7), 1970-1981, 2019
PULP: A parallel ultra low power platform for next generation IoT applications
D Rossi, F Conti, A Marongiu, A Pullini, I Loi, M Gautschi, G Tagliavini, ...
2015 IEEE Hot Chips 27 Symposium (HCS), 1-39, 2015
Neurostream: Scalable and energy efficient deep learning with smart memory cubes
E Azarkhish, D Rossi, I Loi, L Benini
IEEE Transactions on Parallel and Distributed Systems 29 (2), 420-434, 2017
PULP: A ultra-low power parallel accelerator for energy-efficient and flexible embedded vision
F Conti, D Rossi, A Pullini, I Loi, L Benini
Journal of Signal Processing Systems 84, 339-354, 2016
Characterization and implementation of fault-tolerant vertical links for 3-D networks-on-chip
I Loi, F Angiolini, S Fujita, S Mitra, L Benini
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2010
Supporting vertical links for 3d networks-on-chip: Toward an automated design and analysis flow
I Loi, F Angiolini, L Benini
2nd Internationa ICST Conference on Nano-Networks, 2010
A 60 gops/w,− 1.8 v to 0.9 v body bias ulp cluster in 28 nm utbb fd-soi technology
D Rossi, A Pullini, I Loi, M Gautschi, FK Gürkaynak, A Bartolini, ...
Solid-State Electronics 117, 170-184, 2016
Vega: A ten-core SoC for IoT endnodes with DNN acceleration and cognitive wake-up from MRAM-based state-retentive sleep mode
D Rossi, F Conti, M Eggiman, A Di Mauro, G Tagliavini, S Mach, ...
IEEE Journal of Solid-State Circuits 57 (1), 127-139, 2021
Energy-efficient near-threshold parallel computing: The PULPv2 cluster
D Rossi, A Pullini, I Loi, M Gautschi, FK Gürkaynak, A Teman, ...
Ieee Micro 37 (5), 20-31, 2017
An efficient distributed memory interface for many-core platform with 3D stacked DRAM
I Loi, L Benini
2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010 …, 2010
Developing mesochronous synchronizers to enable 3D NoCs
I Loi, F Angiolini, L Benini
Proceedings of the conference on Design, automation and test in Europe, 1414 …, 2008
Design and evaluation of a processing-in-memory architecture for the smart memory cube
E Azarkhish, D Rossi, I Loi, L Benini
Architecture of Computing Systems–ARCS 2016: 29th International Conference …, 2016
Mr. wolf: A 1 gflop/s energy-proportional parallel ultra low power soc for iot edge processing
A Pullini, D Rossi, I Loi, A Di Mauro, L Benini
ESSCIRC 2018-IEEE 44th European Solid State Circuits Conference (ESSCIRC …, 2018
193 MOPS/mW@ 162 MOPS, 0.32 V to 1.15 V voltage range multi-core accelerator for energy efficient parallel and sequential digital processing
D Rossi, A Pullini, I Loi, M Gautschi, FK Gurkaynak, A Teman, ...
2016 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XIX), 1-3, 2016
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