Brownian dynamics simulation to determine the effective thermal conductivity of nanofluids P Bhattacharya, SK Saha, A Yadav, PE Phelan, RS Prasher Journal of Applied Physics 95 (11), 6492-6494, 2004 | 446 | 2004 |
Phonon backscattering and thermal conductivity suppression in sawtooth nanowires AL Moore, SK Saha, RS Prasher, L Shi Applied Physics Letters 93 (8), 2008 | 241 | 2008 |
Thermal contact resistance and thermal conductivity of a carbon nanofiber C Yu, S Saha, J Zhou, L Shi, AM Cassell, BA Cruden, Q Ngo, J Li | 219 | 2006 |
Integration of metal oxide nanobelts with microsystems for nerve agent detection C Yu, Q Hao, S Saha, L Shi, X Kong, ZL Wang Applied Physics Letters 86 (6), 2005 | 206 | 2005 |
Measurement and analysis of thermopower and electrical conductivity of an indium antimonide nanowire from a vapor-liquid-solid method JH Seol, AL Moore, SK Saha, F Zhou, L Shi, QL Ye, R Scheffler, N Mingo, ... Journal of applied physics 101 (2), 2007 | 128 | 2007 |
Molecular dynamics simulation of thermal transport at a nanometer scale constriction in silicon SK Saha, L Shi Journal of applied physics 101 (7), 2007 | 59 | 2007 |
Phase sensitive enhancement for biochemical detection using rotating paramagnetic particle chains AK Vuppu, AA Garcia, MA Hayes, K Booksh, PE Phelan, R Calhoun, ... Journal of applied physics 96 (11), 6831-6838, 2004 | 28 | 2004 |
Monte Carlo simulation of phonon backscattering in a nanowire S Saha, L Shi, RS Prasher ASME International Mechanical Engineering Congress and Exposition 47845, 549-553, 2006 | 17 | 2006 |
Combined thermoelectric and structure characterizations of patterned nanowires A Mavrokefalos, MT Pettes, S Saha, F Zhou, L Shi 2006 25th International Conference on Thermoelectrics, 234-237, 2006 | 13 | 2006 |
Modeling microflow and stirring around a microrotor in creeping flow using a quasi-steady-state analysis AK Vuppu, AA Garcia, SK Saha, PE Phelan, MA Hayes, R Calhoun Lab on a Chip 4 (3), 201-208, 2004 | 13 | 2004 |
Three-dimensional (3d) integrated heat spreader for multichip packages HK Dhavaleswarapu, RD Flynn, SK Saha US Patent App. 14/108,270, 2015 | 9 | 2015 |
Thermal management of packages with 3D die stacking CP Chiu, JY Chang, S Saha 2012 7th International Microsystems, Packaging, Assembly and Circuits …, 2012 | 9 | 2012 |
High performance transient uniform cooling solution for thermal compression bonding process Z Li, HK Dhavaleswarapu, JB Petrini, S Devasenathipathy, SB Roach, ... US Patent 9,434,029, 2016 | 7 | 2016 |
A unique computer-based spectrophotometric system with multiple height exposures of the cuvette to determine vertical velocity of spermatozoa for clinical and biological … D Paul, GC Majumder, S Saha, A Mukherjee, S Banerjee Indian Patent Application File, 2004 | 5 | 2004 |
Determining the effective thermal conductivity of a nanofluid using Brownian dynamics simulation P Bhattacharya, SK Saha, A Yadav, PE Phelan, RS Prasher Heat Transfer Summer Conference 36959, 777-783, 2003 | 5 | 2003 |
Molecular dynamics simulation of thermal transport at nanometer size point contacts on a planar silicon substrate S Saha, L Shi Heat Transfer Summer Conference 47314, 389-396, 2005 | 4 | 2005 |
Simulated behavior of magnetic and nonmagnetic particles in a rotating magnetic field SK Saha Arizona State University, 2003 | 4 | 2003 |
Challenges and opportunities in thermal management of multi-chip packages HK Dhavaleswarapu, CM Jha, SF Smith, S Kothari, B Bicen, SK Saha, ... International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 3 | 2015 |
Reliability of base-isolated liquid storage tanks under horizontal base excitation SK Saha, VA Matsagar Numerical methods for reliability and safety assessment: Multiscale and …, 2015 | 3 | 2015 |
Wind Response of Base-Isolated Building SK Saha, VA Matsagar, A Gupta 14th International Conference on Wind Engineering, Porto Alegre, Brazil, 2015 | 3 | 2015 |