Παρακολούθηση
Tong-Hong Lin
Tong-Hong Lin
Apple
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Παρατίθεται από
Παρατίθεται από
Έτος
Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias
AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ...
IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020
462020
A real-time range-adaptive impedance matching utilizing a machine learning strategy based on neural networks for wireless power transfer systems
S Jeong, TH Lin, MM Tentzeris
IEEE Transactions on Microwave Theory and Techniques 67 (12), 5340-5347, 2019
452019
On-body long-range wireless backscattering sensing system using inkjet-/3-D-printed flexible ambient RF energy harvesters capable of simultaneous DC and harmonics generation
TH Lin, J Bito, JGD Hester, J Kimionis, RA Bahr, MM Tentzeris
IEEE Transactions on Microwave Theory and Techniques 65 (12), 5389-5400, 2017
432017
Bandwidth Enhancement of 44 Butler Matrix Using Broadband Forward-Wave Directional Coupler and Phase Difference Compensation
TH Lin, SK Hsu, TL Wu
IEEE transactions on microwave theory and techniques 61 (12), 4099-4109, 2013
432013
Broadband and miniaturized antenna-in-package (AiP) design for 5G applications
TH Lin, K Kanno, AO Watanabe, PM Raj, RR Tummala, M Swaminathan, ...
IEEE Antennas and Wireless Propagation Letters 19 (11), 1963-1967, 2020
372020
Inkjet-/3D-/4D-printed perpetual electronics and modules: RF and mm-wave devices for 5G+, IoT, smart agriculture, and smart cities applications
A Eid, X He, R Bahr, TH Lin, Y Cui, A Adeyeye, B Tehrani, MM Tentzeris
IEEE Microwave Magazine 21 (12), 87-103, 2020
342020
Leading-edge and ultra-thin 3D glass-polymer 5G modules with seamless antenna-to-transceiver signal transmissions
A Watanabe, TH Lin, PM Raj, V Sundaram, MM Tentzeris, RR Tummala, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2026-2031, 2018
292018
Zero-power sensors for smart objects: Novel zero-power additively manufactured wireless sensor modules for IoT applications
J Kimionis, W Su, J Hester, J Bito, X He, TH Lin, MM Tentzeris
IEEE Microwave Magazine 19 (6), 32-47, 2018
282018
Achieving fully autonomous system-on-package designs: An embedded-on-package 5G energy harvester within 3D printed multilayer flexible packaging structures
TH Lin, S Daskalakis, A Georgiadis, MM Tentzeris
2019 IEEE MTT-S International Microwave Symposium (IMS), 2019
272019
Novel 3D-/inkjet-printed flexible on-package antennas, packaging structures, and modules for broadband 5G applications
TH Lin, R Bahr, MM Tentzeris, PM Raj, V Sundaram, R Tummala
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 214-220, 2018
242018
Nanostructured miniaturized artificial magnetic conductors (AMC) for high-performance antennas in 5G, IoT, and smart skin applications
TH Lin, PM Raj, A Watanabe, V Sundaram, R Tummala, MM Tentzeris
2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO), 911-915, 2017
232017
A flexible compact rectenna for 2.40 Hz ISM energy harvesting applications
A Eid, J Hester, A Nauroze, TH Lin, J Costantine, Y Tawk, AH Ramadan, ...
2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI …, 2018
222018
Package-integrated, wideband power dividing networks and antenna arrays for 28-GHz 5G new radio bands
M Ali, AO Watanabe, TH Lin, D Okamoto, MR Pulugurtha, MM Tentzeris, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
202020
A broadband forward-wave directional coupler using periodic Y-shaped ground via structures with arbitrary coupling levels
JC Yen, SK Hsu, TH Lin, TL Wu
IEEE transactions on microwave theory and techniques 61 (1), 38-47, 2012
192012
A wideband, quasi-isotropic, kilometer-range FM energy harvester for perpetual IoT
EM Jung, Y Cui, TH Lin, X He, A Eid, JGD Hester, GD Abowd, TE Starner, ...
IEEE Microwave and Wireless Components Letters 30 (2), 201-204, 2019
182019
Ambient energy harvesting from two-way talk radio for on-body autonomous wireless sensing network using inkjet and 3D printing
TH Lin, J Bito, JG Hester, J Kimionis, RA Bahr, MM Tentzeris
2017 IEEE MTT-S International Microwave Symposium (IMS), 1034-1037, 2017
152017
Range-adaptive Impedance Matching of Wireless Power Transfer System Using a Machine Learning Strategy Based on Neural Networks
S Jeong, TH Lin, MM Tentzeris
2019 IEEE MTT-S International Microwave Symposium (IMS), 2019
112019
3D glass-based panel-level package with antenna and low-loss interconnects for millimeter-wave 5G applications
AO Watanabe, TH Lin, M Ali, T Ogawa, PM Raj, MM Tentzeris, ...
2019 IEEE MTT-S International Microwave Conference on Hardware and Systems …, 2019
92019
3D glass package-integrated, high-performance power dividing networks for 5G broadband antennas
M Ali, A Watanabe, TH Lin, MR Pulugurtha, MM Tentzeris, RR Tummala
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 960-967, 2019
92019
Size-reduction of 3 dB microstrip forward-wave coupler using defected ground structure
SK Hsu, TH Lin, TL Wu
Asia-Pacific Microwave Conference 2011, 1774-1777, 2011
92011
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