Modeling, design, and demonstration of 2.5 D glass interposers for 16-channel 28 Gbps signaling applications B Sawyer, BC Chou, S Gandhi, J Mateosky, V Sundaram, R Tummala
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2188-2192, 2015
20 2015 A low-cost approach to high-k thinfilm decoupling capacitors on silicon and glass interposers S Gandhi, S Xiang, PM Raj, V Sundaram, M Swaminathan, R Tummala
2012 IEEE 62nd Electronic Components and Technology Conference, 1356-1360, 2012
20 2012 Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics PM Raj, P Chakraborti, H Sharma, KH Han, S Gandhi, S Sitaraman, ...
14th IEEE International Conference on Nanotechnology, 27-31, 2014
18 2014 A new approach to power integrity with thinfilm capacitors in 3D IPAC functional module S Gandhi, PM Raj, V Sundaram, H Sharma, M Swaminathan, R Tummala
2013 IEEE 63rd Electronic Components and Technology Conference, 1197-1203, 2013
17 2013 Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips MD Romig, F Stepniak, S Gandhi
US Patent 9,572,261, 2017
11 2017 Novel nanostructured passives for RF and power applications: Nanopackaging with passive components PM Raj, P Chakraborti, D Mishra, H Sharma, S Gandhi, S Sitaraman, ...
Nanopackaging: From Nanomaterials to the Atomic Scale: Proceedings of the …, 2015
11 2015 High- Thin-Film Capacitors With Conducting Oxide Electrodes on Glass Substrates for Power-Supply Applications S Gandhi, MR Pulugurtha, H Sharma, P Chakraborti, RR Tummala
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016
9 2016 Nanomagnetic structures for inductive coupling and shielding in wireless charging applications D Mishra, S Sitaraman, S Gandhi, S Teng, PM Raj, H Sharma, R Tummala, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 941-945, 2015
8 2015 3D IPAC—A new passives and actives concept for ultra-miniaturized electronic and bioelectronic functional modules PM Raj, UM Jow, J Dai, KP Murali, H Sharma, D Mishra, TD Xiao, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 517-522, 2013
8 2013 Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors S Gandhi, PM Raj, BC Chou, P Chakraborti, MS Kim, S Sitaraman, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 230-235, 2015
7 2015 Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers G Kumar, PM Raj, J Cho, S Gandhi, P Chakraborti, V Sundaram, J Kim, ...
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 541-547, 2014
7 2014 Oxide composition studies of electrochemically grown tantalum oxide on sintered tantalum using XPS depth-profiling and co-relation with leakage properties P Chakraborti, H Sharma, MR Pulugurtha, S Gandhi, RR Tummala
Journal of Materials Science: Materials in Electronics 28, 18773-18780, 2017
6 2017 Dielectric–electrode interactions in glass and silicon-compatible thin-film (Ba,Sr)TiO3 capacitors S Gandhi, S Xiang, M Kumar, H Sharma, P Chakraborti, PM Raj, ...
Journal of Materials Science: Materials in Electronics 28, 595-600, 2017
6 2017 Ultrathin, substrate-integrated, and self-healing nanocapacitors with low-leakage currents and high-operating frequencies P Chakraborti, H Sharma, MR Pulugurtha, KP Rataj, C Schnitter, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016
6 2016 Packaged semiconductor system having unidirectional connections to discrete components S Gandhi, MD Romig, A Castro
US Patent 10,566,276, 2020
5 2020 3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon RG Spurney, H Sharma, PM Raj, R Tummala, N Lollis, M Weaver, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (8 …, 2019
5 2019 Ultra-high density, thin-film tantalum capacitors with improved frequency characteristics for MHz switching power converters RG Spurney, H Sharma, MR Pulugurtha, R Tummala, N Lollis, M Weaver, ...
Journal of Electronic Materials 47, 5632-5639, 2018
5 2018 High-voltage capacitors for next-generation power modules in electric vehicles RG Spurney, H Sharma, PM Raj, RR Tummala, N Lollis, S Gandhi, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1695-1700, 2017
5 2017 First demonstration of copper-plated through-package-via (TPV) reliability in ultra-thin 3D glass interposers with double-side component assembly K Demir, S Gandhi, T Ogawa, R Pucha, V Smet, V Sundaram, PM Raj, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 666-671, 2015
5 2015 Nanowires-based high-density capacitors and thinfilm power sources in ultrathin 3D glass modules S Gandhi, L Li, HY Hui, P Chakraborti, H Sharma, PM Raj, CP Wong, ...
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1492-1497, 2014
5 2014