| A mini review: Lean management tools in assembly line at automotive industry MZM Ismail, AH Zainal, NI Kasim, M Mukhtar IOP Conference Series: Materials Science and Engineering 469 (1), 012086, 2019 | 17 | 2019 |
| Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation FC Ng, LH Tung, MH Zawawi, MAFM Mukhtar, MA Abas, MZ Abdullah CFD Letters 12 (6), 28-38, 2020 | 5 | 2020 |
| Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process RK Apalowo, A Abas, Z Bachok, MFM Sharif, FC Ani, MR Ramli, ... Microelectronics Reliability 146, 115028, 2023 | 4 | 2023 |
| Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process Z Bachok, A Abas, HAL Raja Gobal, N Yusoff, MR Ramli, MF Mohd Sharif, ... Soldering & Surface Mount Technology, 2023 | 2 | 2023 |
| Effect of Peak Temperature on SAC Nano-Reinforced Fillet Height MAFM Mukhtar, MA Abas, FC Ani, AAM Azaman CFD Letters 12 (9), 91-103, 2020 | 2 | 2020 |
| Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation MAFM Mukhtar, A Abas, MS Haslinda, FC Ani, A Jalar, AA Saad, ... Journal of Applied Fluid Mechanics 12 (5), 1683-1696, 2019 | 2 | 2019 |
| Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0 Ag-0.5 Cu (SAC305) MAFM Mukhtar, A Abas, MS Haslinda, FC Ani, MZ Abdullah, A Jalar, ... IOP Conference Series: Materials Science and Engineering 370 (1), 012067, 2018 | 2 | 2018 |
| Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints RK Apalowo, MA Abas, MAFM Mukhtar, FC Ani, MR Ramli Soldering & Surface Mount Technology, 2024 | 1 | 2024 |
| Dynamic FSI simulation of pin transfer process for solder paste transport LH Tung, MAFM Mukhtar, A Abas, A Azman, FC Ng, MN Nashrudin, ... AIP Conference Proceedings 2129 (1), 020088, 2019 | 1 | 2019 |
| TIO2 Nanoparticles Reinforced Lead-Free 96.5 Sn–3.0 Ag–0.5 Cu Solder Paste for Ultra-Fine Package Assembly in Reflow Soldering Process FC Ani, A Jalar, R Ismail, Z Mustafa, AA Saad, CY Khor, NK Othman, ... Journal of Advanced Manufacturing Technology (JAMT) 12 (1 (2)), 413-424, 2018 | 1 | 2018 |
| Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing MS Mohamed Sunar, M Abu Bakar, A Jalar, MAF Muhamed Mukhtar, ... Soldering & Surface Mount Technology, 2023 | | 2023 |
| Effects of Multi-stack Ball Grid Array on Multi-stack Printed Circuit Board M Mukhtar, A Abas, W Bahri IOP Conference Series: Materials Science and Engineering 530 (1), 012017, 2019 | | 2019 |
| Development of Universal Portable Spray Stand for Touch-Up Process in The Automotive Paintshop MAFM Mukhtar, RMS Hameed IOP Conference Series: Materials Science and Engineering 114 (1), 012151, 2016 | | 2016 |
| DESIGN AND IMPLEMENTATION OF SPOT WELDING TRAINER FOR BODY SHOP ASSEMBLY LINE M MUKHTAR, S RAVI, ZFZ ABIDIN, S SIMON | | 2014 |
| DESIGN AND DEVELOPMENT OF DC-DC CONVERTER FOR MAXIMUM VOLTAGE AND MAXIMUM POWER APPLICATIONS S RAVI, AM IBRAHIM, M MUKHTAR, MA MUSA | | 2013 |
| Development of Line Follower Ir Mobile Robot with Obstacle Remover MAFM Mukhtar Universiti Teknologi Malaysia, 2007 | | 2007 |
