| Impacts of diamond heat spreader on the thermo-mechanical characteristics of high-power AlGaN/GaN HEMTs R Zhang, WS Zhao, WY Yin, ZG Zhao, HJ Zhou Diamond and Related Materials 52, 25-31, 2015 | 29 | 2015 |
| A comprehensive time-dependent dielectric breakdown lifetime simulator for both traditional CMOS and FinFET technology K Yang, T Liu, R Zhang, L Milor IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (11 …, 2018 | 21 | 2018 |
| Investigation on thermo-mechanical responses in high power multi-finger AlGaN/GaN HEMTs R Zhang, WS Zhao, WY Yin Microelectronics Reliability 54 (3), 575-581, 2014 | 19 | 2014 |
| Electrothermal characterization of multilevel Cu-graphene heterogeneous interconnects in the presence of an electrostatic discharge (ESD) R Zhang, WS Zhao, J Hu, WY Yin IEEE Transactions on Nanotechnology 14 (2), 205-209, 2014 | 17 | 2014 |
| A comparison study of time-dependent dielectric breakdown for analog and digital circuit's optimal accelerated test regions K Yang, T Liu, R Zhang, L Milor 2017 32nd Conference on Design of Circuits and Integrated Systems (DCIS), 1-6, 2017 | 10 | 2017 |
| Modeling of the reliability degradation of a FinFET-based SRAM due to bias temperature instability, hot carrier injection, and gate oxide breakdown R Zhang, T Liu, K Yang, L Milor 2017 IEEE International Integrated Reliability Workshop (IIRW), 1-4, 2017 | 10 | 2017 |
| Front-end of line and middle-of-line time-dependent dielectric breakdown reliability simulator for logic circuits K Yang, T Liu, R Zhang, DH Kim, L Milor Microelectronics Reliability 76, 81-86, 2017 | 10 | 2017 |
| SRAM stability analysis and performance–reliability tradeoff for different cache configurations R Zhang, T Liu, K Yang, CC Chen, L Milor IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (3), 620-633, 2020 | 8 | 2020 |
| Modeling of FinFET SRAM array reliability degradation due to electromigration R Zhang, KX Yang, TZ Liu, L Milor Microelectronics Reliability 100, 113485, 2019 | 8 | 2019 |
| Circuit-level reliability simulator for front-end-of-line and middle-of-line time-dependent dielectric breakdown in FinFET technology K Yang, T Liu, R Zhang, L Milor 2018 IEEE 36th VLSI Test Symposium (VTS), 1-6, 2018 | 8 | 2018 |
| Analysis of time-dependent dielectric breakdown induced aging of SRAM cache with different configurations R Zhang, T Liu, K Yang, L Milor Microelectronics Reliability 76, 87-91, 2017 | 8 | 2017 |
| Recent progress in physics-based modeling of electromigration in integrated circuit interconnects WS Zhao, R Zhang, DW Wang Micromachines 13 (6), 883, 2022 | 7 | 2022 |
| Modeling for SRAM reliability degradation due to gate oxide breakdown with a compact current model R Zhang, T Liu, K Yang, L Milor 2017 32nd Conference on Design of Circuits and Integrated Systems (DCIS), 1-5, 2017 | 7 | 2017 |
| A library based on deep neural networks for modeling the degradation of FinFET SRAM performance metrics due to aging R Zhang, Z Liu, K Yang, T Liu, W Cai, L Milor Microelectronics Reliability 100, 113486, 2019 | 6 | 2019 |
| Impact of front-end wearout mechanisms on FinFET SRAM soft error rate R Zhang, Z Liu, K Yang, T Liu, W Cai, L Milor Microelectronics Reliability 100, 113487, 2019 | 6 | 2019 |
| A lifetime and power sensitive design optimization framework for a radio frequency circuit K Yang, T Liu, R Zhang, L Milor 2017 IEEE International Integrated Reliability Workshop (IIRW), 1-4, 2017 | 6 | 2017 |
| CacheEM: For reliability analysis on Cache memory aging due to electromigration R Zhang, T Liu, K Yang, L Milor IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2021 | 5 | 2021 |
| Impact of front-end wearout mechanisms on the performance of a ring oscillator-based thermal sensor R Zhang, K Yang, T Liu, L Milor 2019 IEEE 8th International Workshop on Advances in Sensors and Interfaces …, 2019 | 5 | 2019 |
| Estimation of the optimal accelerated test region for FinFET SRAMs degraded by front-end and back-end wearout mechanisms R Zhang, K Yang, T Liu, L Milor 2018 Conference on Design of Circuits and Integrated Systems (DCIS), 1-6, 2018 | 5 | 2018 |
| A comprehensive framework for analysis of time-dependent performance-reliability degradation of SRAM cache memory R Zhang, K Yang, Z Liu, T Liu, W Cai, L Milor IEEE Transactions on Very Large Scale Integration (VLSI) Systems 29 (5), 857-870, 2021 | 3 | 2021 |
Kexin YangGeorgia Institute of TechnologyVerified email at gatech.edu
