Παρακολούθηση
Jun Li
Jun Li
Research Assistant, Physics, Carnegie Mellon University
Η διεύθυνση ηλεκτρονικού ταχυδρομείου έχει επαληθευτεί στον τομέα alumni.cmu.edu
Τίτλος
Παρατίθεται από
Παρατίθεται από
Έτος
Realizing large-scale, electronic-grade two-dimensional semiconductors
YC Lin, B Jariwala, BM Bersch, K Xu, Y Nie, B Wang, SM Eichfeld, ...
ACS nano 12 (2), 965-975, 2018
2132018
Large scale 2D/3D hybrids based on gallium nitride and transition metal dichalcogenides
K Zhang, B Jariwala, J Li, NC Briggs, B Wang, D Ruzmetov, RA Burke, ...
Nanoscale 10 (1), 336-341, 2018
482018
Properties of synthetic epitaxial graphene/molybdenum disulfide lateral heterostructures
S Subramanian, DD Deng, K Xu, N Simonson, K Wang, K Zhang, J Li, ...
Carbon 125, 551-556, 2017
402017
Tuning electronic transport in epitaxial graphene-based van der Waals heterostructures
YC Lin, J Li, SC de La Barrera, SM Eichfeld, Y Nie, R Addou, PC Mende, ...
Nanoscale 8 (16), 8947-8954, 2016
292016
Formation of hexagonal boron nitride on graphene-covered copper surfaces
DP Gopalan, PC Mende, SC de la Barrera, S Dhingra, J Li, K Zhang, ...
Journal of Materials Research 31 (7), 945-958, 2016
242016
ACS Nano 9, 2080 (2015)
SM Eichfeld, L Hossain, YC Lin, AF Piasecki, B Kupp, AG Birdwell, ...
Article, 0
15
Substitutional mechanism for growth of hexagonal boron nitride on epitaxial graphene
PC Mende, J Li, RM Feenstra
Applied Physics Letters 113 (3), 2018
112018
ACS Nano 12, 965 (2018)
YC Lin, B Jariwala, BM Bersch, K Xu, Y Nie, B Wang, SM Eichfeld, ...
11
Characteristics of Interlayer Tunneling Field-Effect Transistors Computed by a “DFT-Bardeen” Method
J Li, Y Nie, K Cho, RM Feenstra
Journal of Electronic Materials 46, 1378-1389, 2017
92017
Magnitude of the current in 2D interlayer tunneling devices
RM Feenstra, SC De la Barrera, J Li, Y Nie, K Cho
Journal of Physics: Condensed Matter 30 (5), 055703, 2018
72018
Formation of graphene atop a Si adlayer on the C-face of SiC
RMF Jun Li, Qingxiao Wang, Guowei He, Michael Widom, Lydia Nemec, Volker ...
Phys. Rev. Materials 3, 084006, 2019
32019
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