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Coauteurs
- Atul SharmaRahul Bajaj Chair Professor & Head, Department of Mechanical Engineering, IIT Bombay, IndiaAdresse e-mail validée de iitb.ac.in
- Rajneesh BhardwajProfessor, Department of Mechanical Engineering, IIT BombayAdresse e-mail validée de iitb.ac.in
- Nagesh Devidas PatilAssistant Professor, Mechanical Engg., Indian Institute of Technology BhilaiAdresse e-mail validée de iitbhilai.ac.in
- Ankur MiglaniAssociate Professor, Indian Institute of Technology, Indore, Purdue University, KAISTAdresse e-mail validée de iiti.ac.in
- AASTHA UPPALPackaging R&D Engineer (Thermal/Mechanical)Adresse e-mail validée de intel.com
- Divya ManiPackaging Thermal R&D Engineer, Intel CorporationAdresse e-mail validée de intel.com
- Yashraj BhosaleUniversity of Illinois at Urbana-ChampaignAdresse e-mail validée de illinois.edu
- Dr Absar LakdawalaProfessor, Mechanical Engineering, Nirma UniversityAdresse e-mail validée de nirmauni.ac.in